[Android 0]

TL;DR

• Xiaomi’s next foldable has leaked, showing a wide inner display and a design that closely resembles the company’s own HyperOS 4 teaser.
• The XRing O3 will power the device, with a 10-core CPU, Arm’s new G2-Ultra NX GPU, and eye-catching performance claims.
• The Xiaomi 18 Fold launches in September, but key details such as global availability, pricing, and dimensions remain unknown.

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Xiaomi’s XRing O3 chipset has already made headlines with some seriously ambitious performance claims, but the chip’s first phone may be just as interesting. Xiaomi has confirmed that the 3nm processor will debut in the Xiaomi 18 Fold next month, and now leaked images appear to show the company’s upcoming foldable in the flesh.

The images, which Digital Chat Station (DCS) shared on Weibo, show a book-style foldable with a wide inner display similar to the Galaxy Z Fold 8, relatively thick bezels, and a punch-hole selfie camera near the upper-right corner. One image also shows the rear of the device, including a large camera module, but it doesn’t reveal enough to say much about its hardware.